Facile preparation and strong adhesive strength of honeycomb polyurethane films with small pore diameter

With the continuous development of bionics, such as, geckos and virginia creeper with both superhydrophobic and super-adhesive, the surface wetting and super-adhesive properties of various porous materials have attracted extensive attention of the scientific and medical communities. Here, the honeycomb polyurethane (PU) porous films with strong adhesion were successfully prepared by microphase separation method and the effects of growth parameters on their microstructure and adhesive strength to ice were investigated. It was found that a high relative humidity (e.g., 100%) and a low solution concentration (e.g., 2%) facilitated the formation of ordered honeycomb PU porous films, and as-prepared PU pores with average pore diameter as small as 5 μm are better ordered and more uniform than these in related documents. Although the contact angle of water droplets on the surface of PU porous films increased from the premodification value of 85–130° to more than 160° after surface modification with polydopamine (PDA), the corresponding rolling angle remained approximately constant (180°), indicating that the surface of PU porous films has strong adhesion similar to geckos and virginia creeper. Furthermore, at lower temperature, the PU porous films exhibited the high adhesive strength of 142.13 kPa on ice, which was strongly dependent on the porous microstructures and surface compositions. The improved adhesive behavior to ice of honeycomb PU porous films modified with PDA provides new strategies for surface modification of materials and potential applications in medical domain.     

Digital image correlation strain measurement of thick adherend shear test specimen joined with an epoxy film adhesive

Structural bonding and bonded repairs of composite materials become more and more important. Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used. However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.     

Recycling of multilayer packaging using a reversible cross-linking adhesive

Plastic-based multilayer packaging has an important function on the packaging market, but is currently not recyclable as the polymer layers used are usually thermodynamically immiscible. This work therefore follows the approach to prepare separable multilayer packaging using a packaging adhesive modified with thermally unstable adducts, and proposes a corresponding recycling process. For this purpose, typical multilayer structures (polyethylene (PE)// polyethylene terephtalate (PET), PET//aluminum, and PE//aluminum) were prepared by curing furan-/maleimide-functionalized polyurethane (PU)-prepolymers with a three-functional cross-linking agent. Adhesions of up to over 3N per 15 mm test specimen were measured or substrate failures of PET films were observed. However, heating in dimethylsulfoxide, the retro-Diels–Alder reaction takes place and the cross-linked adhesive turns thermoplastic and dissolves in the solvent. Thus, the laminate separates and the pure PE, PET, and aluminum foils can be recovered without any PU residue.     

Crosslinked acrylic pressure‐sensitive adhesives. II. Effect of humidity on the crosslinking reaction

The effect of humidity during storage on the crosslinking reactions of isocyanate groups was investigated with attenuated total reflectance Fourier transform infrared spectroscopy with pressure‐sensitive adhesives composed of poly[ethyl acrylate‐co‐(2‐ethylhexyl acrylate)‐co‐(2‐hydroxyethyl methacrylate)] as a base resin and polyisocyanate as a crosslinker. A peak‐resolving analysis of the amide II region revealed four bands. According to an analysis of the Fourier transform infrared spectra of the model compounds, these four bands were assigned to free urethane linkages, hydrogen‐bonded urethane linkages, free urea linkages, and hydrogen‐bonded urea linkages. As expected, storage under humid conditions led to the formation of free and hydrogen‐bonded urea linkages corresponding to the promotion of isocyanate consumption. Peak resolution of the amide II region was found to be a reasonable way of monitoring urethane and urea linkages during crosslinking reactions. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3039–3045, 2003     

Structural acrylic adhesives for the sheet steel fabrication industries

Recent developments in rubber-toughened structural acrylic adhesives now offer sheet steel fabricators the opportunity to replace conventional metal fastening techniques such as spot welding with lower cost, durable, more versatile structural adhesive bonding. These developments, in particular much improved ability to bond oily/waxy surfaces common to the motor car industry and improved retention of fracture toughness after exposure to paint stoving temperatures, are discussed in this paper.     

Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

The concept of an endurance limit for adhesive joints

The effect of cyclic stressing on the strength of single lap adhesive joints has been studied and a considerable reduction in strength observed when the maximum stress exceeds about 40% of the ultimate tensile strength, but whether or not a true endurance limit exists is not proven. Fallacies are shown in some of the techniques which have been proposed for studying the fatigue behaviour of adhesive joints.     

Off-Optimum Cure of Aerospace Epoxy Adhesives

Four epoxy film adhesives used in aircraft manufacture and repair have been examined to establish the effect of deviation from the cure cycle specified by the manufacturer. In addition to the variation of the cure cycle, two surface preparations of the aluminium adherends (chromic acid etch or grit blast followed by silane treatment) were evaluated. Thermal analysis was used to examine the cure envelope of the adhesive, and its extent of cure and glass transition temperature. The adhesive properties were assessed by shear strength (in both single lap joints and in Iosipescu configuration), durability (Boeing wedge test) and chemical resistance to selected aggressive fluids. The sensitivity of the performance of a particular adhesive to offoptimum cure conditions depends on its composition and needs to be determined, not predicted.     

结构粘结剂的试验研究

粘结剂是粘钢加固技术的关键材料,通过对粘结剂的试验研究,得到了粘结剂的拉压试验曲线与材料力学指标以及粘附于各种标号混凝土时,粘结层的抗剪强度;并且还进行了粘结剂的短期流变试验。     

Water‐soluble/dispersible cationic pressure‐sensitive adhesives. I. Adhesives from solution polymerization

Pressure‐sensitive adhesives (PSAs) have long been a problem as sticky contaminants for paper recycling mills. The main problem associated with such stickies is that the PSAs in the waste papers deposit on the felts, press rolls, and drying cylinders of paper machines, and this creates problems with paper formation, reducing the paper quality and paper machine runnability. The annual cost of stickies to the U.S. paper industry is estimated to be about $600,000,000–650,000,000. To solve this problem, a series of cationic water‐soluble/dispersible PSAs have been synthesized by the free‐radical solution polymerization of butyl acrylate and [3‐(methacryloylamino)propyl]trimethylammonium chloride in ethanol. The PSA end‐use properties, repulpability in paper recycling, and the effects on the properties of recycled paper products have been studied. The cationic PSAs can be dissolved or dispersed in water if the cationic charge density in the PSA backbone is controlled, and so they do not deposit as stickies during recycling and papermaking processes. Because the PSAs are cationically charged, they can easily be removed from the papermaking system by adsorption onto the negatively charged fibers and fine surfaces. Furthermore, the adsorbed colloidal or dissolved PSAs have little effect on the final paper properties. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1624–1630, 2003